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HUF76143P3, HUF76143S3S
Data Sheet January 2003
75A, 30V, 0.0055 Ohm, N-Channel, Logic Level UltraFET Power MOSFETs
These N-Channel power MOSFETs are manufactured using the innovative UltraFETTM process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. It was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, lowvoltage bus switches, and power management in portable and battery-operated products. Formerly developmental type TA76143.
Features
* Logic Level Gate Drive * 75A, 30V * Ultra Low On-Resistance, rDS(ON) = 0.0055 * Temperature Compensating PSPICE(R) Model * Temperature Compensating SABER(c) Mode * Thermal Impedance SPICE Model * Thermal Impedance SABER Model * Peak Current vs Pulse Width Curve * UIS Rating Curve * Related Literature - TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"
Ordering Information
PART NUMBER HUF76143P3 HUF76143S3S PACKAGE TO-220AB TO-263AB BRAND 76143P 76143S
Symbol
D
G
NOTE: When ordering, use the entire part number. Add the suffix T to obtain the TO-263AB variant in tape and reel, e.g., HUF76143S3ST.
S
Packaging
JEDEC TO-220AB
SOURCE DRAIN GATE DRAIN (FLANGE)
JEDEC TO-263AB
GATE SOURCE
DRAIN (FLANGE)
(c)2003 Fairchild Semiconductor Corporation
HUF76143P3, HUF76143S3S Rev. B1
HUF76143P3, HUF76143S3S
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified UNITS Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS Drain to Gate Voltage (R GS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Drain Current Continuous (TC = 25oC, VGS = 10V) (Figure 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Continuous (TC = 100oC, VGS = 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Continuous (TC = 100oC, VGS = 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg 30 30 20 75 75 75 Figure 4 Figure 6 225 1.8 -40 to 150 300 260 W W/oC
oC oC oC
V V V A A A
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. TJ = 25oC to 150oC.
Electrical Specifications
PARAMETER OFF STATE SPECIFICATIONS
TC = 25oC, Unless Otherwise Specified SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage Zero Gate Voltage Drain Current
BVDSS IDSS
ID = 250A, V GS = 0V (Figure 12) VDS = 25V, VGS = 0V VDS = 25V, VGS = 0V, TC = 150oC
30 -
-
1 250 100
V A A nA
Gate to Source Leakage Current ON STATE SPECIFICATIONS Gate to Source Threshold Voltage Drain to Source On Resistance
IGSS
VGS = 20V
VGS(TH) rDS(ON)
VGS = VDS, ID = 250A (Figure 11) ID = 75A, VGS = 10V (Figures 9, 10) ID = 75A, VGS = 5V (Figure 9) ID = 75A, VGS = 4.5V (Figure 9)
1 -
0.0052 0.0063 0.0068
3 0.0055 0.0075 0.0085
V
THERMAL SPECIFICATIONS Thermal Resistance Junction to Case Thermal Resistance Junction to Ambient SWITCHING SPECIFICATIONS (VGS = 4.5V) Turn-On Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-Off Time tON td(ON) tr td(OFF) tf tOFF VDD = 15V, ID 75A, RL = 0.2, VGS = 4.5V, RGS = 2.5 22 145 30 18 250 72 ns ns ns ns ns ns RJC RJA (Figure 3) TO-220 and TO-263 0.55 62
oC/W oC/W
(c)2003 Fairchild Semiconductor Corporation
HUF76143P3, HUF76143S3S Rev. B1
HUF76143P3, HUF76143S3S
Electrical Specifications
PARAMETER SWITCHING SPECIFICATIONS (VGS = 10V) Turn-On Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-Off Time GATE CHARGE SPECIFICATIONS Total Gate Charge Gate Charge at 5V Threshold Gate Charge Gate to Source Gate Charge Gate to Drain "Miller" Charge CAPACITANCE SPECIFICATIONS Input Capacitance Output Capacitance Reverse Transfer Capacitance CISS COSS CRSS VDS = 25V, VGS = 0V, f = 1MHz (Figure 13) 3900 1600 270 pF pF pF Qg(TOT) Qg(5) Qg(TH) Qgs Qgd VGS = 0V to 10V VGS = 0V to 5V VGS = 0V to 1V VDD = 15V, ID 75A, RL = 0.2 Ig(REF) = 1.0mA (Figures 14, 19, 20) 11.70 22.00 nC nC 95 50 3.8 114 60 4.6 nC nC nC tON td(ON) tr td(OFF) tf tOFF VDD = 15V, ID 75A, RL = 0.2, VGS = 10V, RGS = 2.5 (Figures 16, 21, 20) 14 55 40 18 105 87 ns ns ns ns ns ns TC = 25oC, Unless Otherwise Specified (Continued) SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Specifications
PARAMETER Source to Drain Diode Voltage Reverse Recovery Time Reverse Recovered Charge SYMBOL VSD trr QRR ISD = 75A ISD = 75A, dISD/dt = 100A/s ISD = 75A, dISD/dt = 100A/s TEST CONDITIONS MIN TYP MAX 1.25 90 170 UNITS V ns nC
Typical Performance Curves
1.2 POWER DISSIPATION MULTIPLIER 1.0 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 TA , AMBIENT TEMPERATURE (oC) 10 25 50 75 100 125 150 TC, CASE TEMPERATURE (oC) 80
ID, DRAIN CURRENT (A)
60 VGS = 10V 40 VGS = 4.5V 20
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs CASE TEMPERATURE
(c)2003 Fairchild Semiconductor Corporation
HUF76143P3, HUF76143S3S Rev. B1
HUF76143P3, HUF76143S3S Typical Performance Curves
2 1 THERMAL IMPEDANCE ZJC, NORMALIZED DUTY CYCLE - DESCENDING ORDER 0.5 0.2 0.1 0.05 0.02 0.01 PDM 0.1 t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJC x RJC + TC 10-3 10-2 10 -1 t, RECTANGULAR PULSE DURATION (s) 10 0 101
(Continued)
SINGLE PULSE 0.01 10-5 10 -4
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
2000 TC = 25oC FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS: I = I25 150 - TC 125
IDM, PEAK CURRENT (A)
1000
VGS = 5V VGS = 10V 100 TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION 10-4 10-3 10-2 t, PULSE WIDTH (s) 10-1 100 101
50 10-5
FIGURE 4. PEAK CURRENT CAPABILITY
1000 IAS, AVALANCHE CURRENT (A) TJ = MAX RATED TC = 25oC ID, DRAIN CURRENT (A) 100s
500
If R = 0 tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD) If R 0 tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
100
100 STARTING TJ = 25oC
1ms 10 OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON) BVDSS MAX = 30V 1 10 VDS, DRAIN TO SOURCE VOLTAGE (V) 100 10ms
STARTING TJ = 150oC
1
10 0.001
0.01
0.1 1 10 tAV, TIME IN AVALANCHE (ms)
100
NOTE: Refer to Fairchild Application Notes AN9321 and AN9322. FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
(c)2003 Fairchild Semiconductor Corporation
HUF76143P3, HUF76143S3S Rev. B1
HUF76143P3, HUF76143S3S Typical Performance Curves
200
(Continued)
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VDD = 15V ID, DRAIN CURRENT (A)
200
VGS = 10V VGS = 5V VGS = 4V VGS = 3.5V
I D, DRAIN CURRENT (A)
150
150
100
100
50 25oC
150oC -40oC
50
VGS = 3V PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX TC = 25oC 0 1 2 3 4 VDS, DRAIN TO SOURCE VOLTAGE (V) 5
0 0 1 2 3 4 5 VGS, GATE TO SOURCE VOLTAGE (V)
0
FIGURE 7. TRANSFER CHARACTERISTICS
FIGURE 8. SATURATION CHARACTERISTICS
15 ID = 75A rDS(ON), DRAIN TO SOURCE ON RESISTANCE (m) 2 ID = 50A NORMALIZED DRAIN TO SOURCE ON RESISTANCE PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX
1.6
1.4
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VGS = 10V, ID = 75A
1.2
9
1.0
6
ID = 25A
0.8
3 2 4 6 8 VGS, GATE TO SOURCE VOLTAGE (V) 10
0.7 -60 0 60 120 180 TJ, JUNCTION TEMPERATURE (oC)
FIGURE 9. SOURCE TO DRAIN ON RESISTANCE vs GATE VOLTAGE AND DRAIN CURRENT
FIGURE 10. NORMALIZED DRAIN TO SOURCE ON RESISTANCE vs JUNCTION TEMPERATURE
1.2 NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE VGS = VDS, I D = 250A NORMALIZED GATE THRESHOLD VOLTAGE
1.2 ID = 250A
1.0
1.1
0.8
1.0
0.6
0.5 -60 0 60 120 180 TJ, JUNCTION TEMPERATURE (oC)
0.9 -60 0 60 120 180 TJ , JUNCTION TEMPERATURE (oC)
FIGURE 11. NORMALIZED GATE THRESHOLD VOLTAGE vs JUNCTION TEMPERATURE
FIGURE 12. NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE vs JUNCTION TEMPERATURE
(c)2003 Fairchild Semiconductor Corporation
HUF76143P3, HUF76143S3S Rev. B1
HUF76143P3, HUF76143S3S Typical Performance Curves
5000 VGS , GATE TO SOURCE VOLTAGE (V)
(Continued)
10
C, CAPACITANCE (pF)
4000
8
CISS VGS = 0V, f = 1MHz CISS = CGS + CGD CRSS = CGD COSS CDS + C GD COSS
3000
6
2000
4 WAVEFORMS IN DESCENDING ORDER: ID = 75A ID = 50A ID = 25A 80 100
1000 CRSS 0 0 5 10 15 20 25 VDS , DRAIN TO SOURCE VOLTAGE (V) 30
2 VDD = 15V 0 0 20
40 60 Qg, GATE CHARGE (nC)
NOTE: Refer to Fairchild Application Notes 7254 and 7260. FIGURE 13. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE FIGURE 14. GATE CHARGE WAVEFORMS FOR CONSTANT GATE CURRENT
800 VGS = 4.5V, VDD = 15V, ID = 75A, RL = 0.2 SWITCHING TIME (ns) SWITCHING TIME (ns) 600 tr 400 td(OFF) tf
800 VGS = 10V, VDD = 15V, ID = 75A, R L = 0.2 600 td(OFF) 400 tf 200 tr td(ON) 0 0 20 30 40 RGS, GATE TO SOURCE RESISTANCE () 10 50 0 10 20 30 40 RGS, GATE TO SOURCE RESISTANCE () 50
200 td(ON) 0
FIGURE 15. SWITCHING TIME vs GATE RESISTANCE
FIGURE 16. SWITCHING TIME vs GATE RESISTANCE
Test Circuits and Waveforms
VDS BVDSS L VARY tP TO OBTAIN REQUIRED PEAK IAS VGS DUT tP RG IAS VDD tP VDS VDD
+
0V
IAS 0.01
0 tAV
FIGURE 17. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 18. UNCLAMPED ENERGY WAVEFORMS
(c)2003 Fairchild Semiconductor Corporation
HUF76143P3, HUF76143S3S Rev. B1
HUF76143P3, HUF76143S3S Test Circuits and Waveforms
(Continued)
VDS RL VDD VDS VGS = 10V VGS
+
Qg(TOT)
Qg(5) VDD VGS VGS = 1V 0 Qg(TH) IgREF) 0 VGS = 5V
DUT Ig(REF)
FIGURE 19. GATE CHARGE TEST CIRCUIT
FIGURE 20. GATE CHARGE WAVEFORMS
VDS
tON td(ON) RL VDS 90% tr
tOFF td(OFF) tf 90%
VGS
+
DUT RGS
VDD 0
10% 90%
10%
VGS VGS 0 10%
50% PULSE WIDTH
50%
FIGURE 21. SWITCHING TIME TEST CIRCUIT
FIGURE 22. SWITCHING TIME WAVEFORM
(c)2003 Fairchild Semiconductor Corporation
HUF76143P3, HUF76143S3S Rev. B1
HUF76143P3, HUF76143S3S PSPICE Electrical Model
SUBCKT HUF76143 2 1 3 ;
CA 12 8 5.2e-9 CB 15 14 5e-9 CIN 6 8 3.65e-9 DBODY 7 5 DBODYMOD DBREAK 5 11 DBREAKMOD DPLCAP 10 5 DPLCAPMOD EBREAK 11 7 17 18 39.38 EDS 14 8 5 8 1 EGS 13 8 6 8 1 ESG 6 10 6 8 1 EVTHRES 6 21 19 8 1 EVTEMP 20 6 18 22 1
ESG LDRAIN DPLCAP 10 RSLC1 51 ESLC 50 RLDRAIN DBREAK 11 + 17 EBREAK 18 5 DRAIN 2
REV March 1998
RSLC2
5 51
6 8 + LGATE GATE 1 RLGATE CIN EVTEMP RGATE + 18 22 9 20 EVTHRES + 19 8 6
IT 8 17 1 LDRAIN 2 5 1e-9 LGATE 1 9 2.6e-9 LSOURCE 3 7 1.1e-9 MMED 16 6 8 8 MMEDMOD MSTRO 16 6 8 8 MSTROMOD MWEAK 16 21 8 8 MWEAKMOD RBREAK 17 18 RBREAKMOD 1 RDRAIN 50 16 RDRAINMOD 1.5e-3 RGATE 9 20 0.92 RLDRAIN 2 5 10 RLGATE 1 9 26 RLSOURCE 3 7 11 RSLC1 5 51 RSLCMOD 1e-6 RSLC2 5 50 1e3 RSOURCE 8 7 RSOURCEMOD 3e-3 RVTHRES 22 8 RVTHRESMOD 1 RVTEMP 18 19 RVTEMPMOD 1 S1A S1B S2A S2B 6 12 13 8 S1AMOD 13 12 13 8 S1BMOD 6 15 14 13 S2AMOD 13 15 14 13 S2BMOD
S1A 12 S1B CA 13 8
MSTRO LSOURCE 8 RSOURCE RLSOURCE S2A 14 13 S2B 15 17 RBREAK 18 RVTEMP CB + 6 8 EDS 5 8 14 IT 19 7 SOURCE 3
13 + EGS
-
-
VBAT 22 19 DC 1 ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*425),4))} .MODEL DBODYMOD D (IS = 1.2e-11 RS = 2.65e-3 TRS1 = 2.3e-3 TRS2 = -4.2e-6 CJO = 5.45e-9 TT = 3.9e-8 XTI = 4.3 N = 1.03 M = 0.43) .MODEL DBREAKMOD D (RS = 8.5e-2 TRS1 =0 TRS2 =0) .MODEL DPLCAPMOD D (CJO = 2.6e-9 IS = 1e-30 N = 10 M = 0.7) .MODEL MMEDMOD NMOS (VTO = 1.9 KP = 10 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 0.92) .MODEL MSTROMOD NMOS (VTO = 2.26KP = 215 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u) .MODEL MWEAKMOD NMOS (VTO = 1.62 KP = 0.1 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 9.2 RS = 0.1) .MODEL RBREAKMOD RES (TC1 = 9.8e-4 TC2 = -4e-7) .MODEL RDRAINMOD RES (TC1 = 1e-2 TC2 = 0) .MODEL RSLCMOD RES (TC1 = 3e-3 TC2 = -2e-5) .MODEL RSOURCEMOD RES (TC1 = 5e-4 TC2 = 1.1e-5) .MODEL RVTHRESMOD RES (TC = -2.2e-3 TC2 = -6e-6) .MODEL RVTEMPMOD RES (TC1 = -1.45e-3 TC2 = -2e-6) .MODEL S1AMOD VSWITCH (RON = 1e-5 .MODEL S1BMOD VSWITCH (RON = 1e-5 .MODEL S2AMOD VSWITCH (RON = 1e-5 .MODEL S2BMOD VSWITCH (RON = 1e-5 .ENDS ROFF = 0.1 ROFF = 0.1 ROFF = 0.1 ROFF = 0.1 VON = -5 VOFF= -2) VON = -2 VOFF= -5) VON = -1.5 VOFF= 1) VON = 1 VOFF= -1.5)
NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley.
(c)2003 Fairchild Semiconductor Corporation
+
-
RDRAIN 21 16
DBODY
MWEAK MMED
VBAT +
8 22 RVTHRES
HUF76143P3, HUF76143S3S Rev. B1
HUF76143P3, HUF76143S3S SABER Electrical Model
REV March 1998 template huf76143 n2, n1, n3 electrical n2, n1, n3 { var i iscl d..model dbodymod = (is = 1.2e-11, xti = 4.3, cjo = 5.45e-9, tt = 3.9e-8, n = 1.03, m = 0.43) d..model dbreakmod = () d..model dplcapmod = (cjo = 2.6e-9, is = 1e-30, n = 10, m = 0.70) m..model mmedmod = (type=_n, vto = 1.9, kp = 10, is = 1e-30, tox = 1) m..model mstrongmod = (type=_n, vto = 2.26, kp = 215, is = 1e-30, tox = 1) m..model mweakmod = (type=_n, vto = 1.62, kp = 0.1, is = 1e-30, tox = 1) sw_vcsp..model s1amod = (ron = 1e-5, roff = 0.1, von = -5, voff = -2) DPLCAP sw_vcsp..model s1bmod = (ron = 1e-5, roff = 0.1, von = -2, voff = -5) 10 sw_vcsp..model s2amod = (ron = 1e-5, roff = 0.1, von = -1.5, voff = 1) sw_vcsp..model s2bmod = (ron = 1e-5, roff = 0.1, von = 1, voff = -1.5) c.ca n12 n8 = 5.2e-9 c.cb n15 n14 = 5e-9 c.cin n6 n8 = 3.65e-9 d.dbody n7 n71 = model=dbodymod d.dbreak n72 n11 = model=dbreakmod d.dplcap n10 n5 = model=dplcapmod i.it n8 n17 = 1 l.ldrain n2 n5 = 1e-9 l.lgate n1 n9 = 2.6e-9 l.lsource n3 n7 = 1.1e-9
GATE 1 RLGATE CIN LGATE RSLC2 ISCL
LDRAIN 5 RLDRAIN RDBREAK 72 DBREAK 11 MWEAK MMED MSTRO 8 EBREAK + 17 18 71 RDBODY DRAIN 2 RSLC1 51
ESG + EVTEMP RGATE + 18 22 9 20 6 6 8 EVTHRES + 19 8
50 RDRAIN 21 16
DBODY
m.mmed n16 n6 n8 n8 = model=mmedmod, l = 1u, w = 1u m.mstrong n16 n6 n8 n8 = model=mstrongmod, l = 1u, w = 1u m.mweak n16 n21 n8 n8 = model=mweakmod, l = 1u, w = 1u res.rbreak n17 n18 = 1, tc1 = 9.8e-4, tc2 = -4e-7 res.rdbody n71 n5 = 2.65e-3, tc1 = 2.3e-3, tc2 = -4.2e-6 res.rdbreak n72 n5 = 8.5e-2, tc1 = 0, tc2 = 0 res.rdrain n50 n16 = 1.5e-3, tc1 = 1e-2, tc2 = 0 res.rgate n9 n20 = 0.92 res.rldrain n2 n5 = 10 res.rlgate n1 n9 = 26 res.rlsource n3 n7 = 11 res.rslc1 n5 n51 = 1e-6, tc1 = 3e-3, tc2 = -2e-5 res.rslc2 n5 n50 = 1e3 res.rsource n8 n7 = 3e-3, tc1 = 5e-4, tc2 = 1.1e-5 res.rvtemp n18 n19 = 1, tc1 = -1.45e-3, tc2 = -2e-6 res.rvthres n22 n8 = 1, tc1 = -2.2e-3, tc2 = -6e-6 spe.ebreak n11 n7 n17 n18 = 39.38 spe.eds n14 n8 n5 n8 = 1 spe.egs n13 n8 n6 n8 = 1 spe.esg n6 n10 n6 n8 = 1 spe.evtemp n20 n6 n18 n22 = 1 spe.evthres n6 n21 n19 n8 = 1 sw_vcsp.s1a n6 n12 n13 n8 = model=s1amod sw_vcsp.s1b n13 n12 n13 n8 = model=s1bmod sw_vcsp.s2a n6 n15 n14 n13 = model=s2amod sw_vcsp.s2b n13 n15 n14 n13 = model=s2bmod v.vbat n22 n19 = dc = 1 equations { i (n51->n50) + = iscl iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/425))** 4)) } }
S1A 12 13 8 S1B CA 13 + EGS 6 8 S2A 14 13 S2B
RSOURCE
LSOURCE 7 RLSOURCE
SOURCE 3
15
RBREAK 17 18 RVTEMP
CB + EDS 5 8 14 IT
19
VBAT +
-
-
8 22 RVTHRES
(c)2003 Fairchild Semiconductor Corporation
HUF76143P3, HUF76143S3S Rev. B1
HUF76143P3, HUF76143S3S SPICE Thermal Model
REV March 1998 HUF76143 CTHERM1 th 6 5.0e-3 CTHERM2 6 5 1.2e-2 CTHERM3 5 4 2.0e-2 CTHERM4 4 3 2.8e-2 CTHERM5 3 2 2e-1 CTHERM6 2 tl 3 RTHERM1 th 6 2.0e-3 RTHERM2 6 5 2.0e-2 RTHERM3 5 4 6.9e-2 RTHERM4 4 3 1.3e-1 RTHERM5 3 2 7.5e-2 RTHERM6 2 tl 3.0e-2
RTHERM1 CTHERM1 th JUNCTION
6
RTHERM2
CTHERM2
5
RTHERM3
CTHERM3
SABER Thermal Model
Saber thermal model HUF76143 template thermal_model th tl thermal_c th, tl { ctherm.ctherm1 th 6 = 5.0e-3 ctherm.ctherm2 6 5 = 1.2e-2 ctherm.ctherm3 5 4 = 2.0e-2 ctherm.ctherm4 4 3 = 2.8e-2 ctherm.ctherm5 3 2 = 2.0e-1 ctherm.ctherm6 2 tl = 3 rtherm.rtherm1 th 6 = 2.0e-3 rtherm.rtherm2 6 5 = 2.0e-2 rtherm.rtherm3 5 4 = 6.9e-2 rtherm.rtherm4 4 3 = 1.3e-1 rtherm.rtherm5 3 2 = 7.5e-2 rtherm.rtherm6 2 tl = 3.0e-2 }
4
RTHERM4
CTHERM4
3
RTHERM5
CTHERM5
2
RTHERM6
CTHERM6
tl
CASE
(c)2003 Fairchild Semiconductor Corporation
HUF76143P3, HUF76143S3S Rev. B1
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
Rev. I2

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